Invention Grant
- Patent Title: System and method for intelligent data/frame compression in a system on a chip
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Application No.: US15490625Application Date: 2017-04-18
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Publication No.: US10484685B2Publication Date: 2019-11-19
- Inventor: Serag Gadelrab , Chinchuan Chiu , Moinul Khan , Kyle Ernewein , Tom Longo , Simon Booth , Meghal Varia , Milivoje Aleksic , King-Chung Lai
- Applicant: QUALCOMM INCORPORATED
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Smith Tempel Blaha LLC/Qualcomm
- Main IPC: H04N19/127
- IPC: H04N19/127 ; G06F3/06 ; H04N19/426 ; H04N19/176 ; H04N19/65 ; G06T3/40 ; G01K13/00

Abstract:
An exemplary method for intelligent compression defines a threshold value for a key performance indicator. Based on the key performance indicator value, data blocks generated by a producer component may be scaled down to reduce power and/or bandwidth consumption when being compressed according to a lossless compression module. The compressed data blocks are then stored in a memory component along with metadata that signals the scaling factor used prior to compression. Consumer components later retrieving the compressed data blocks from the memory component may decompress the data blocks and upscale, if required, based on the scaling factor signaled by the metadata.
Public/Granted literature
- US20180302625A1 SYSTEM AND METHOD FOR INTELLIGENT DATA/FRAME COMPRESSION IN A SYSTEM ON A CHIP Public/Granted day:2018-10-18
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