Invention Grant
- Patent Title: Low profile fan assemblies
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Application No.: US15835147Application Date: 2017-12-07
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Publication No.: US10485136B2Publication Date: 2019-11-19
- Inventor: Shankar Gopalakrishna , Kiran Devapalan , Saju Cheeran Verghese Francis , Vivekananda Avvaru , Anil KC
- Applicant: Seagate Technology LLC
- Applicant Address: US CA Cupertino
- Assignee: Seagate Technology LLC
- Current Assignee: Seagate Technology LLC
- Current Assignee Address: US CA Cupertino
- Agency: Faegre Baker Daniels LLP
- Main IPC: H05K7/20
- IPC: H05K7/20 ; G06F1/20 ; G06F1/18 ; H05K7/14
Abstract:
A fan assembly includes a fan module having a plurality of mounting openings, a housing partially surrounding the fan module, and a plurality of dampers that extend through the plurality of mounting openings to couple the fan module to the housing.
Public/Granted literature
- US20190182982A1 LOW PROFILE FAN ASSEMBLIES Public/Granted day:2019-06-13
Information query
