公开(公告)号：US20190182982A1

公开(公告)日：2019-06-13

申请号：US15835147

申请日：2017-12-07

Applicant: Seagate Technology LLC

Inventor： Shankar Gopalakrishna ,  Kiran Devapalan ,  Saju Cheeran Verghese Francis ,  Vivekananda Avvaru ,  Anil KC

IPC: H05K7/20 ,  G06F1/20 ,  G06F1/18 ,  H05K7/14

CPC classification number: H05K7/20172 ,  G06F1/181 ,  G06F1/20 ,  H05K7/1402 ,  H05K7/1422 ,  H05K7/20581 ,  H05K7/20727

Abstract: A fan assembly includes a fan module having a plurality of mounting openings, a housing partially surrounding the fan module, and a plurality of dampers that extend through the plurality of mounting openings to couple the fan module to the housing.

公开(公告)号：US10485136B2

公开(公告)日：2019-11-19

申请号：US15835147

申请日：2017-12-07

Applicant: Seagate Technology LLC

Inventor： Shankar Gopalakrishna ,  Kiran Devapalan ,  Saju Cheeran Verghese Francis ,  Vivekananda Avvaru ,  Anil KC

IPC: H05K7/20 ,  G06F1/20 ,  G06F1/18 ,  H05K7/14

Abstract: A fan assembly includes a fan module having a plurality of mounting openings, a housing partially surrounding the fan module, and a plurality of dampers that extend through the plurality of mounting openings to couple the fan module to the housing.