公开(公告)号：US11019748B2

公开(公告)日：2021-05-25

申请号：US15853203

申请日：2017-12-22

Applicant: Seagate Technology LLC

Inventor： Vivekananda Avvaru ,  Shankar Gopalakrishna ,  Saju Cheeran Verghese Francis ,  Odie Killen

IPC: H05K7/20 ,  H05K7/14 ,  F21V33/00 ,  G11B33/14 ,  F21Y115/10

Abstract: A system includes a drawer and a fan assembly. The drawer includes a mounting structure with a support surface and an aperture. The fan assembly extends through the aperture and includes a fan module and a top cover. The top cover is coupled to the support surface.

公开(公告)号：US20190182982A1

公开(公告)日：2019-06-13

申请号：US15835147

申请日：2017-12-07

Applicant: Seagate Technology LLC

Inventor： Shankar Gopalakrishna ,  Kiran Devapalan ,  Saju Cheeran Verghese Francis ,  Vivekananda Avvaru ,  Anil KC

IPC: H05K7/20 ,  G06F1/20 ,  G06F1/18 ,  H05K7/14

CPC classification number: H05K7/20172 ,  G06F1/181 ,  G06F1/20 ,  H05K7/1402 ,  H05K7/1422 ,  H05K7/20581 ,  H05K7/20727

Abstract: A fan assembly includes a fan module having a plurality of mounting openings, a housing partially surrounding the fan module, and a plurality of dampers that extend through the plurality of mounting openings to couple the fan module to the housing.

公开(公告)号：US10955881B2

公开(公告)日：2021-03-23

申请号：US15584741

申请日：2017-05-02

Applicant: Seagate Technology, LLC

Inventor： Shankar Gopalakrishna ,  Vivekananda Avvaru ,  Saju Cheeran Verhgese Francis

IPC: G06F1/20 ,  H01L23/40 ,  G06F1/18 ,  H01L23/02 ,  H01L23/367 ,  F28D15/00

Abstract: An electronic memory module can be cooled by a cooling assembly that consists of at least a printed circuit board connected to at least one data storage component. The memory module may be housed within, and in physical contact with, a cooling frame that surrounds a periphery of the printed circuit board. The cooling frame can have a seating tab that is separated from the memory module, spans the memory module, and supports a heatsink in contact with the at least one data storage component.

公开(公告)号：US20190200481A1

公开(公告)日：2019-06-27

申请号：US15853203

申请日：2017-12-22

Applicant: Seagate Technology LLC

Inventor： Vivekananda Avvaru ,  Shankar Gopalakrishna ,  Saju Cheeran Verghese Francis ,  Odie Killen

IPC: H05K7/20 ,  H05K7/14 ,  F21V33/00

CPC classification number: H05K7/20172 ,  F21V33/0096 ,  F21Y2115/10 ,  H05K7/1421 ,  H05K7/1487 ,  H05K7/1489 ,  H05K7/20727

Abstract: A system includes a drawer and a fan assembly. The drawer includes a mounting structure with a support surface and an aperture. The fan assembly extends through the aperture and includes a fan module and a top cover. The top cover is coupled to the support surface.

公开(公告)号：US10485136B2

公开(公告)日：2019-11-19

申请号：US15835147

申请日：2017-12-07

Applicant: Seagate Technology LLC

Inventor： Shankar Gopalakrishna ,  Kiran Devapalan ,  Saju Cheeran Verghese Francis ,  Vivekananda Avvaru ,  Anil KC

IPC: H05K7/20 ,  G06F1/20 ,  G06F1/18 ,  H05K7/14

Abstract: A fan assembly includes a fan module having a plurality of mounting openings, a housing partially surrounding the fan module, and a plurality of dampers that extend through the plurality of mounting openings to couple the fan module to the housing.

公开(公告)号：US20180321715A1

公开(公告)日：2018-11-08

申请号：US15584741

申请日：2017-05-02

Applicant: Seagate Technology, LLC

Inventor： Shankar Gopalakrishna ,  Vivekananda Avvaru ,  Saju Cheeran Verhgese Francis

IPC: G06F1/20 ,  H01L23/40

CPC classification number: G06F1/20 ,  F28D15/00 ,  H01L23/02 ,  H01L23/4093

Abstract: An electronic memory module can be cooled by a cooling assembly that consists of at least a printed circuit board connected to at least one data storage component. The memory module may be housed within, and in physical contact with, a cooling frame that surrounds a periphery of the printed circuit board. The cooling frame can have a seating tab that is separated from the memory module, spans the memory module, and supports a heatsink in contact with the at least one data storage component.