Invention Grant
- Patent Title: Metal assisted chemical etching for fabricating high aspect ratio and straight silicon nanopillar arrays for sorting applications
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Application No.: US15139951Application Date: 2016-04-27
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Publication No.: US10507466B2Publication Date: 2019-12-17
- Inventor: Huan Hu , Joshua T. Smith , Gustavo A. Stolovitzky , Benjamin H. Wunsch
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Vazken Alexanian
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L21/3213 ; H01L21/3105 ; H01L21/306 ; G01N5/02 ; G01N5/00 ; B01L3/00 ; G01N15/02 ; G01N15/00
Abstract:
Techniques relate to forming a sorting device. A mesh is formed on top of a substrate. Metal assisted chemical etching is performed to remove substrate material of the substrate at locations of the mesh. Pillars are formed in the substrate by removal of the substrate material. The mesh is removed to leave the pillars in a nanopillar array. The pillars in the nanopillar array are designed with a spacing to sort particles of different sizes such that the particles at or above a predetermined dimension are sorted in a first direction and the particles below the predetermined dimension are sorted in a second direction.
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