Invention Grant
- Patent Title: CMOS-MEMS structure and method of forming the same
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Application No.: US16058897Application Date: 2018-08-08
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Publication No.: US10508027B2Publication Date: 2019-12-17
- Inventor: Jung-Huei Peng , Chia-Hua Chu , Fei-Lung Lai , Shiang-Chi Lin
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C., Intellectual Property Attorneys
- Agent Anthony King
- Main IPC: B81C1/00
- IPC: B81C1/00 ; B81B7/00

Abstract:
The present disclosure provides a CMOS structure, including a substrate, a metallization layer over the substrate, a sensing structure over the metallization layer, and a signal transmitting structure adjacent to the sensing structure. The sensing structure includes an outgassing layer over the metallization layer, a patterned outgassing barrier over the outgassing layer; and an electrode over the patterned outgassing barrier. The signal transmitting structure electrically couples the electrode and the metallization layer.
Public/Granted literature
- US20180362335A1 CMOS-MEMS STRUCTURE AND METHOD OF FORMING THE SAME Public/Granted day:2018-12-20
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