Invention Grant
- Patent Title: Semiconductor system including heterogeneous memory module
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Application No.: US15844165Application Date: 2017-12-15
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Publication No.: US10509744B2Publication Date: 2019-12-17
- Inventor: Jeong Ho Lee , Sung Roh Yoon , Eui Young Chung , Jin Woo Kim , Young Jin Cho , Myeong Jin Kim , Sei Joon Kim , Jeong Bin Kim , Hyeok Jun Choe
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Volentine, Whitt & Francos, PLLC
- Priority: KR10-2016-0183311 20161230
- Main IPC: G06F13/16
- IPC: G06F13/16 ; G06F13/28

Abstract:
A semiconductor system includes a CPU connected to a heterogeneous memory module via a system bus. The heterogeneous memory module includes; a volatile memory module, a nonvolatile memory module, an internal bus separate from the system bus and connecting the volatile memory module and the nonvolatile memory module, and a swap manager configured to control execution of a swap operation transferring target data between the volatile memory module and nonvolatile memory module using the internal bus and without using of the system bus.
Public/Granted literature
- US20180189206A1 SEMICONDUCTOR SYSTEM INCLUDING HETEROGENEOUS MEMORY MODULE Public/Granted day:2018-07-05
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