公开(公告)号：US10509744B2

公开(公告)日：2019-12-17

申请号：US15844165

申请日：2017-12-15

申请人： SAMSUNG ELECTRONICS CO., LTD.

发明人： Jeong Ho Lee ,  Sung Roh Yoon ,  Eui Young Chung ,  Jin Woo Kim ,  Young Jin Cho ,  Myeong Jin Kim ,  Sei Joon Kim ,  Jeong Bin Kim ,  Hyeok Jun Choe

IPC分类号： G06F13/16 ,  G06F13/28

摘要： A semiconductor system includes a CPU connected to a heterogeneous memory module via a system bus. The heterogeneous memory module includes; a volatile memory module, a nonvolatile memory module, an internal bus separate from the system bus and connecting the volatile memory module and the nonvolatile memory module, and a swap manager configured to control execution of a swap operation transferring target data between the volatile memory module and nonvolatile memory module using the internal bus and without using of the system bus.