Invention Grant
- Patent Title: Method of fabricating device including two-dimensional material
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Application No.: US16120775Application Date: 2018-09-04
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Publication No.: US10515798B2Publication Date: 2019-12-24
- Inventor: Tae-jin Park , Bong-soo Kim , Jin-bum Kim , Yoo-sang Hwang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR10-2017-0112494 20170904
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L29/786 ; H01L29/06 ; H01L29/423 ; H01L29/66 ; H01L29/78 ; H01L29/778 ; H01L29/24 ; H01L29/16 ; H01L29/20

Abstract:
A method of fabricating a device including a two-dimensional (2D) material includes forming a transition metal oxide pattern on a substrate and forming a transition metal dichalcogenide layer on a top surface and a side surface of a residual portion of the transition metal oxide pattern. The forming the transition metal dichalcogenide layer may include replacing a surface portion of the transition metal oxide pattern with the transition metal dichalcogenide layer. The transition metal dichalcogenide layer includes at least one atomic layer that is substantially parallel to a surface of the residual portion of the transition metal oxide pattern.
Public/Granted literature
- US20190074180A1 METHOD OF FABRICATING DEVICE INCLUDING TWO-DIMENSIONAL MATERIAL Public/Granted day:2019-03-07
Information query
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