Invention Grant
- Patent Title: Semiconductor device
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Application No.: US16562454Application Date: 2019-09-06
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Publication No.: US10522415B1Publication Date: 2019-12-31
- Inventor: En-Chiuan Liou , Yu-Cheng Tung , Chih-Wei Yang
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsin-Chu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsin-Chu
- Agent Winston Hsu
- Priority: TW105125890A 20160815
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L21/8234 ; H01L29/08 ; H01L29/06 ; H01L27/12 ; H01L21/84 ; H01L29/66 ; H01L21/82

Abstract:
A semiconductor device includes a semiconductor substrate, a gate structure, an isolation structure, and a source/drain region. The semiconductor substrate includes a fin. The gate structure is disposed on the fin and is disposed straddling the fin. The isolation structure covers a sidewall and a top surface of the fin. The source/drain region is disposed in the fin and extends beyond the top surface of the fin.
Public/Granted literature
- US20190393099A1 SEMICONDUCTOR DEVICE Public/Granted day:2019-12-26
Information query
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