Invention Grant
- Patent Title: Laminate package of chip on carrier and in cavity
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Application No.: US15487942Application Date: 2017-04-14
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Publication No.: US10522433B2Publication Date: 2019-12-31
- Inventor: Juergen Hoegerl , Horst Theuss , Gottfried Beer
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Priority: DE102016107031 20160415
- Main IPC: H01L23/051
- IPC: H01L23/051 ; H01L23/06 ; H01L21/48 ; H01L23/00 ; H01L21/56 ; H01L23/31 ; H01L23/13 ; H01L23/14 ; H01L23/488 ; H01L23/538 ; H05K1/18 ; H05K3/46
Abstract:
A package which comprises a chip carrier made of a first material, a body made of a second material differing from the first material and being arranged on the chip carrier so as to form a cavity, a semiconductor chip arranged at least partially in the cavity, and a laminate encapsulating at least one of at least part of the chip carrier, at least part of the body and at least part of the semiconductor chip.
Public/Granted literature
- US20170316994A1 Laminate package of chip on carrier and in cavity Public/Granted day:2017-11-02
Information query
IPC分类:
