Invention Grant
- Patent Title: Contact structures with porous networks for solder connections, and methods of fabricating same
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Application No.: US15858791Application Date: 2017-12-29
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Publication No.: US10531574B2Publication Date: 2020-01-07
- Inventor: Liang Wang , Rajesh Katkar , Hong Shen , Cyprian Emeka Uzoh
- Applicant: INVENSAS CORPORATION
- Applicant Address: US CA San Jose
- Assignee: Invensas Corporation
- Current Assignee: Invensas Corporation
- Current Assignee Address: US CA San Jose
- Main IPC: H05K1/11
- IPC: H05K1/11 ; H01L23/00 ; H05K3/40 ; H05K3/34
Abstract:
A contact pad includes a solder-wettable porous network (310) which wicks the molten solder (130) and thus restricts the lateral spread of the solder, thus preventing solder bridging between adjacent contact pads.
Public/Granted literature
- US20180124927A1 CONTACT STRUCTURES WITH POROUS NETWORKS FOR SOLDER CONNECTIONS, AND METHODS OF FABRICATING SAME Public/Granted day:2018-05-03
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