Invention Grant
- Patent Title: Three-dimensional stacked memory optimizations for latency and power
-
Application No.: US15847954Application Date: 2017-12-20
-
Publication No.: US10534545B2Publication Date: 2020-01-14
- Inventor: Diyanesh B. Chinnakkonda Vidyapoornachary , John B. DeForge , Warren E. Maule , Kirk D. Peterson , Sridhar H. Rangarajan , Saravanan Sethuraman
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Cantor Colburn LLP
- Agent Bryan Bortnick
- Main IPC: G06F3/06
- IPC: G06F3/06 ; G06F9/455 ; G06F13/42

Abstract:
An aspect includes receiving a request to write data to a memory that includes a stack of memory devices, each of the memory devices communicatively coupled to at least one other of the memory devices in the stack via a through silicon via (TSV). The write request is received by a hypervisor from an application executing on a virtual machine managed by the hypervisor. In response to receiving the request a latency requirement of accesses to the write data is determined. A physical location on a memory device in the stack of memory devices is assigned to the write data based at least in part on the latency requirement and a position of the memory device in the stack of memory devices. A write command that includes the physical location and the write data is sent to a memory controller.
Public/Granted literature
- US20190187915A1 THREE-DIMENSIONAL STACKED MEMORY OPTIMIZATIONS FOR LATENCY AND POWER Public/Granted day:2019-06-20
Information query