Invention Grant
- Patent Title: Forming transistor by selectively growing gate spacer
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Application No.: US16048483Application Date: 2018-07-30
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Publication No.: US10535569B2Publication Date: 2020-01-14
- Inventor: Kai-Hsuan Lee , Chia-Ta Yu , Cheng-Yu Yang , Sheng-Chen Wang , Bo-Yu Lai , Bo-Cyuan Lu , Chi On Chui , Sai-Hooi Yeong , Feng-Cheng Yang , Yen-Ming Chen
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/8238
- IPC: H01L21/8238 ; H01L27/092 ; H01L29/49 ; H01L29/08 ; H01L21/8234 ; H01L29/66

Abstract:
A method includes forming a gate dielectric layer on a semiconductor fin, and forming a gate electrode over the gate dielectric layer. The gate electrode extends on sidewalls and a top surface of the semiconductor fin. A gate spacer is selectively deposited on a sidewall of the gate electrode. An exposed portion of the gate dielectric layer is free from a same material for forming the gate spacer deposited thereon. The method further includes etching the gate dielectric layer using the gate spacer as an etching mask to expose a portion of the semiconductor fin, and forming an epitaxy semiconductor region based on the semiconductor fin.
Public/Granted literature
- US20180337100A1 Forming Transistor by Selectively Growing Gate Spacer Public/Granted day:2018-11-22
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