- 专利标题： Substrate case and substrate accommodation apparatus
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申请号： US12976149申请日： 2010-12-22
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公开(公告)号： US10541160B2公开(公告)日： 2020-01-21
- 发明人: Hideo Mizutani , Tohru Kiuchi , Toru Kawaguchi , Takashi Masukawa
- 申请人： Hideo Mizutani , Tohru Kiuchi , Toru Kawaguchi , Takashi Masukawa
- 申请人地址： JP Tokyo
- 专利权人： Nikon Corporation
- 当前专利权人： Nikon Corporation
- 当前专利权人地址： JP Tokyo
- 代理机构： Finnegan, Henderson, Farabow, Garrett & Dunner, L.L.P.
- 主分类号： B65H19/22
- IPC分类号： B65H19/22 ; H01L21/67 ; B65H75/28 ; H01L21/673
摘要：
A substrate case includes a shaft portion around which a sheet-shaped substrate having a circuit area in which a circuit manufacturing process is performed is wound; and a cover portion that accommodates the substrate in the state of being wound around the shaft portion, the shaft portion having a holding portion that holds an area different from the circuit area at a winding start portion of the substrate.
公开/授权文献
- US20110155838A1 SUBSTRATE CASE AND SUBSTRATE ACCOMMODATION APPARATUS 公开/授权日：2011-06-30
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