- Patent Title: Micromechanical resonator and resonator system including the same
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Application No.: US15870546Application Date: 2018-01-12
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Publication No.: US10541670B2Publication Date: 2020-01-21
- Inventor: Yongseop Yoon , Sungchan Kang , Cheheung Kim , Sangha Park , Choongho Rhee , Hyeokki Hong
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2017-0091060 20170718
- Main IPC: H03B5/30
- IPC: H03B5/30 ; H03H3/007 ; H03H9/24 ; H03H9/02

Abstract:
Provided are micromechanical resonators and resonator systems including the micromechanical resonators. The micromechanical resonators may each include a supporting beam including a fixed end fixed on a supporting member and a loose end configured to vibrate, and a lumped mass arranged on the loose end, wherein the loose end has a width greater than a width of the fixed end, and a width of the lumped mass is greater than that the width of the fixed end.
Public/Granted literature
- US20190028084A1 MICROMECHANICAL RESONATOR AND RESONATOR SYSTEM INCLUDING THE SAME Public/Granted day:2019-01-24
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