Invention Grant
- Patent Title: System and method for a transducer in an eWLB package
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Application No.: US16227761Application Date: 2018-12-20
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Publication No.: US10546752B2Publication Date: 2020-01-28
- Inventor: Stephan Pindl , Daniel Lugauer , Dominic Maier , Alfons Dehe
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee: INFINEON TECHNOLOGIES AG
- Current Assignee Address: DE Neubiberg
- Agency: Slater Matsil, LLP
- Main IPC: H01L21/306
- IPC: H01L21/306 ; H01L21/20 ; H01L21/18 ; H01L33/00 ; H01L21/762 ; H01L23/31 ; H01L23/057 ; H01L23/053 ; G01N27/12 ; H01L23/29 ; H01L23/00 ; H01L21/02 ; H01L21/302 ; G01N27/02 ; G01N33/00 ; H01L21/56 ; H01L23/538 ; H05K1/18
Abstract:
According to an embodiment, a sensor package includes an electrically insulating substrate including a cavity in the electrically insulating substrate, an ambient sensor, an integrated circuit die embedded in the electrically insulating substrate, and a plurality of conductive interconnect structures coupling the ambient sensor to the integrated circuit die. The ambient sensor is supported by the electrically insulating substrate and arranged adjacent the cavity.
Public/Granted literature
- US20190148253A1 System and Method for a Transducer in an eWLB Package Public/Granted day:2019-05-16
Information query
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