公开(公告)号：US20170284951A1

公开(公告)日：2017-10-05

申请号：US15086573

申请日：2016-03-31

申请人： Infineon Technologies AG

发明人： Stephan Pindl ,  Daniel Lugauer ,  Dominic Maier ,  Alfons Dehe

IPC分类号： G01N27/02 ,  H01L21/56 ,  H01L23/538 ,  H05K1/18 ,  H01L23/31

CPC分类号： H01L23/315 ,  G01N27/028 ,  G01N27/128 ,  G01N33/0036 ,  H01L21/185 ,  H01L21/187 ,  H01L21/2007 ,  H01L21/561 ,  H01L21/568 ,  H01L21/7624 ,  H01L23/053 ,  H01L23/057 ,  H01L23/291 ,  H01L23/295 ,  H01L23/296 ,  H01L23/31 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/5386 ,  H01L24/19 ,  H01L24/24 ,  H01L24/96 ,  H01L33/0079 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2224/73267 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/1815 ,  H01L2924/18162 ,  H01L2924/3025 ,  H05K1/181

摘要： According to an embodiment, a sensor package includes an electrically insulating substrate including a cavity in the electrically insulating substrate, an ambient sensor, an integrated circuit die embedded in the electrically insulating substrate, and a plurality of conductive interconnect structures coupling the ambient sensor to the integrated circuit die. The ambient sensor is supported by the electrically insulating substrate and arranged adjacent the cavity.

公开(公告)号：US20190148253A1

公开(公告)日：2019-05-16

申请号：US16227761

申请日：2018-12-20

申请人： Infineon Technologies AG

发明人： Stephan Pindl ,  Daniel Lugauer ,  Dominic Maier ,  Alfons Dehe

IPC分类号： H01L23/31 ,  H01L23/053 ,  H01L23/538 ,  H01L23/057 ,  H01L21/762 ,  H01L21/18 ,  H01L33/00 ,  H01L21/20 ,  G01N33/00 ,  H05K1/18 ,  H01L21/56 ,  G01N27/02 ,  G01N27/12 ,  H01L23/29 ,  H01L23/00

摘要： According to an embodiment, a sensor package includes an electrically insulating substrate including a cavity in the electrically insulating substrate, an ambient sensor, an integrated circuit die embedded in the electrically insulating substrate, and a plurality of conductive interconnect structures coupling the ambient sensor to the integrated circuit die. The ambient sensor is supported by the electrically insulating substrate and arranged adjacent the cavity.

公开(公告)号：US20200051824A1

公开(公告)日：2020-02-13

申请号：US16654165

申请日：2019-10-16

申请人： Infineon Technologies AG

发明人： Stephan Pindl ,  Daniel Lugauer ,  Dominic Maier ,  Alfons Dehe

IPC分类号： H01L21/306 ,  H01L23/31 ,  H01L21/762 ,  H01L21/02 ,  H01L21/302 ,  H01L21/20 ,  H01L21/18 ,  H01L33/00 ,  H01L23/057 ,  H01L23/053 ,  G01N27/12 ,  H01L23/29 ,  H01L23/00 ,  G01N27/02 ,  G01N33/00 ,  H01L21/56 ,  H01L23/538 ,  H05K1/18

摘要： According to an embodiment, a sensor package includes an electrically insulating substrate including a cavity in the electrically insulating substrate, an ambient sensor, an integrated circuit die embedded in the electrically insulating substrate, and a plurality of conductive interconnect structures coupling the ambient sensor to the integrated circuit die. The ambient sensor is supported by the electrically insulating substrate and arranged adjacent the cavity.

公开(公告)号：US10186468B2

公开(公告)日：2019-01-22

申请号：US15086573

申请日：2016-03-31

申请人： Infineon Technologies AG

发明人： Stephan Pindl ,  Daniel Lugauer ,  Dominic Maier ,  Alfons Dehe

IPC分类号： H01L23/31 ,  H01L21/20 ,  H01L21/18 ,  H01L33/00 ,  H01L21/762 ,  H01L23/057 ,  H01L23/053 ,  G01N27/02 ,  G01N33/00 ,  H01L21/56 ,  H01L23/538 ,  H05K1/18 ,  G01N27/12 ,  H01L23/00 ,  H01L23/29

摘要： According to an embodiment, a sensor package includes an electrically insulating substrate including a cavity in the electrically insulating substrate, an ambient sensor, an integrated circuit die embedded in the electrically insulating substrate, and a plurality of conductive interconnect structures coupling the ambient sensor to the integrated circuit die. The ambient sensor is supported by the electrically insulating substrate and arranged adjacent the cavity.

公开(公告)号：US11211298B2

公开(公告)日：2021-12-28

申请号：US16654165

申请日：2019-10-16

申请人： Infineon Technologies AG

发明人： Stephan Pindl ,  Daniel Lugauer ,  Dominic Maier ,  Alfons Dehe

IPC分类号： H01L23/053 ,  H01L21/20 ,  H01L21/18 ,  H01L21/762 ,  H01L23/31 ,  H01L23/057 ,  G01N27/12 ,  H01L23/29 ,  H01L23/00 ,  H01L21/306 ,  H01L21/02 ,  H01L21/302 ,  H01L33/00 ,  G01N27/02 ,  G01N33/00 ,  H01L21/56 ,  H01L23/538 ,  H05K1/18

摘要： According to an embodiment, a sensor package includes an electrically insulating substrate including a cavity in the electrically insulating substrate, an ambient sensor, an integrated circuit die embedded in the electrically insulating substrate, and a plurality of conductive interconnect structures coupling the ambient sensor to the integrated circuit die. The ambient sensor is supported by the electrically insulating substrate and arranged adjacent the cavity.

公开(公告)号：US10546752B2

公开(公告)日：2020-01-28

申请号：US16227761

申请日：2018-12-20

申请人： Infineon Technologies AG

发明人： Stephan Pindl ,  Daniel Lugauer ,  Dominic Maier ,  Alfons Dehe

IPC分类号： H01L21/306 ,  H01L21/20 ,  H01L21/18 ,  H01L33/00 ,  H01L21/762 ,  H01L23/31 ,  H01L23/057 ,  H01L23/053 ,  G01N27/12 ,  H01L23/29 ,  H01L23/00 ,  H01L21/02 ,  H01L21/302 ,  G01N27/02 ,  G01N33/00 ,  H01L21/56 ,  H01L23/538 ,  H05K1/18

摘要： According to an embodiment, a sensor package includes an electrically insulating substrate including a cavity in the electrically insulating substrate, an ambient sensor, an integrated circuit die embedded in the electrically insulating substrate, and a plurality of conductive interconnect structures coupling the ambient sensor to the integrated circuit die. The ambient sensor is supported by the electrically insulating substrate and arranged adjacent the cavity.