- Patent Title: Electronic substrates and interposers made from nanoporous films
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Application No.: US15499756Application Date: 2017-04-27
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Publication No.: US10553358B2Publication Date: 2020-02-04
- Inventor: Mark Bachman , Guann-Pyng Li
- Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
- Applicant Address: US CA Oakland
- Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
- Current Assignee: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
- Current Assignee Address: US CA Oakland
- Agency: One LLP
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01G4/10 ; H01L23/64 ; H01L23/50
Abstract:
An electronic substrate or interposer comprising nanoporous films, such as anodic aluminum oxide, containing vertically etched openings (“vias”) that are filled with a conductive material, forming a high density collection of vertically oriented vias that conduct electricity from one side of the substrate to the other.
Public/Granted literature
- US20170316881A1 ELECTRONIC SUBSTRATES AND INTERPOSERS MADE FROM NANOPOROUS FILMS Public/Granted day:2017-11-02
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