Invention Grant
- Patent Title: Laser machining device and laser machining method
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Application No.: US15398332Application Date: 2017-01-04
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Publication No.: US10556293B2Publication Date: 2020-02-11
- Inventor: Kenshi Fukumitsu
- Applicant: HAMAMATSU PHOTONICS K.K.
- Applicant Address: JP Hamamatsu-shi, Shizuoka
- Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee: HAMAMATSU PHOTONICS K.K.
- Current Assignee Address: JP Hamamatsu-shi, Shizuoka
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2009-186586 20090811
- Main IPC: B23K26/00
- IPC: B23K26/00 ; B23K26/0622 ; C03B33/02 ; B23K26/53 ; B23K26/06 ; B28D5/00 ; B23K103/00

Abstract:
The controllability of modified spots is improved. A laser processing apparatus 100 comprises a first laser light source 101 for emitting a first pulsed laser light L1, a second laser light source 102 for emitting a second pulsed laser light L2, half-wave plates 104, 105 for respectively changing directions of polarization of the pulsed laser light L1, L2, polarization beam splitters 106, 107 for respectively polarization-separating the pulsed laser light L1, L2 having changed the directions of polarization, and a condenser lens 112 for converging the polarization-separated pulsed laser light L1, L2 at an object to be processed 1. When the directions of polarization of the pulsed laser light L1, L2 changed by the half-wave plates 104, 105 are varied by a light intensity controller 121 in the laser processing apparatus 100, the ratios of the pulsed laser light L1, L2 polarization-separated by the polarization beam splitters 106, 107 are altered, whereby the respective intensities of the pulsed laser light L1, L2 are adjusted.
Public/Granted literature
- US20170113298A1 LASER MACHINING DEVICE AND LASER MACHINING METHOD Public/Granted day:2017-04-27
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