Invention Grant
- Patent Title: Two dimension material fin sidewall
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Application No.: US16052526Application Date: 2018-08-01
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Publication No.: US10559564B2Publication Date: 2020-02-11
- Inventor: Sami Rosenblatt , Rasit O. Topaloglu
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: ZIP Group PLLC
- Main IPC: H01L27/088
- IPC: H01L27/088 ; H01L21/8234 ; H01L29/16 ; H01L29/51 ; H01L29/165 ; H01L21/762 ; H01L29/06 ; H01L21/02 ; H01L21/82 ; H01L21/8238 ; H01L21/3105

Abstract:
A semiconductor structure includes fins that have a 2D material, such as Graphene, upon at least the fin sidewalls. The thickness of the 2D material sidewall may be tuned to achieve desired finFET band gap control. Neighboring fins of the semiconductor structure form fin wells. The semiconductor structure may include a fin cap upon each fin and the 2D material is formed upon the sidewalls of the fin and the bottom surface of the fin wells. The semiconductor structure may include a well-plug at the bottom of the fin wells and the 2D material is formed upon the sidewalls and upper surface of the fins. The semiconductor structure may include both fin caps and well-plugs such that the 2D material is formed only upon the sidewalls of the fins.
Public/Granted literature
- US20180342511A1 Two Dimension Material Fin Sidewall Public/Granted day:2018-11-29
Information query
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