Invention Grant
- Patent Title: Photocurable and thermosetting resin composition, cured product, and laminate
-
Application No.: US15622503Application Date: 2017-06-14
-
Publication No.: US10563088B2Publication Date: 2020-02-18
- Inventor: Hiroki Fukaumi , Youichi Matsuo , Atsushi Tsukao
- Applicant: Kaneka Corporation
- Applicant Address: JP Osaka
- Assignee: KANEKA CORPORATION
- Current Assignee: KANEKA CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Osha Liang LLP
- Priority: JP2014-254404 20141216; JP2015-067512 20150327
- Main IPC: C09D171/00
- IPC: C09D171/00 ; C09D7/40 ; C08K3/22 ; C08G59/20 ; C08J7/04 ; C08L63/00 ; C09D163/00 ; C08G77/08 ; B05D7/24 ; C08K3/36 ; C09D183/06 ; B32B27/00 ; C08L83/06 ; C09D7/61 ; C08G65/26

Abstract:
A curable composition includes a condensation product having a weight average molecular weight of 30,000 or less and a curing agent, the condensation product being obtained by hydrolysis and condensation of a first and second silane compound in the presence of a neutral salt catalyst. The condensation product also has a ratio Y/X of 0.2 or less, wherein X is the number of moles of an OR3 group directly bonded to silicon atoms of the first and second silane compounds, and Y is the number of moles of an OR3 group directly bonded to a silicon atom of the condensation product. The first silane compound is represented by R1—(SiR2a(OR3)3-a), and the second silane compound is represented by R4—(SiR2a(OR3)3-a).
Public/Granted literature
- US20170283649A1 PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND LAMINATE Public/Granted day:2017-10-05
Information query
IPC分类: