Invention Grant
- Patent Title: Packaged semiconductor device having patterned conductance dual-material nanoparticle adhesion layer
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Application No.: US15913648Application Date: 2018-03-06
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Publication No.: US10573586B2Publication Date: 2020-02-25
- Inventor: Benjamin Stassen Cook , Daniel Yong Lin
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee: TEXAS INSTRUMENTS INCORPORATED
- Current Assignee Address: US TX Dallas
- Agent Michael A. Davis, Jr.; Charles A. Brill; Frank D. Cimino
- Main IPC: H01L23/495
- IPC: H01L23/495 ; H01L21/67 ; H01L21/48 ; H01L21/56 ; H01L23/29 ; H01L23/00

Abstract:
Described examples include a substrate made of a first material and having a surface. First and second nozzles respectively dispense a first solvent paste including electrically conductive nanoparticles and a second solvent paste including non-conductive nanoparticles, while moving over the surface of the substrate. The first and second nozzles additively deposit a uniform layer including sequential and contiguous zones, alternating between the first solvent paste and the second solvent paste. Energy is applied to sinter together the nanoparticles and diffuse the nanoparticles into the substrate. The sintered nanoparticles form a layer composed of an alternating sequence of electrically conductive zones contiguous with electrically non-conductive zones.
Public/Granted literature
- US20180240741A1 Packaged Semiconductor Device Having Patterned Conductance Dual-Material Nanoparticle Adhesion Layer Public/Granted day:2018-08-23
Information query
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