Invention Grant
- Patent Title: Spot heater and device for cleaning wafer using the same
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Application No.: US16029828Application Date: 2018-07-09
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Publication No.: US10576582B2Publication Date: 2020-03-03
- Inventor: Young-Hoo Kim , Il-Sang Lee , Yong-sun Ko , Chang-Gil Ryu , Kun-Tack Lee , Hyo-San Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2014-0117800 20140904
- Main IPC: H01L21/00
- IPC: H01L21/00 ; B23K26/146 ; B08B7/00 ; B08B3/10 ; C11D11/00 ; H01L21/67 ; H01L21/687
Abstract:
A spot heater and a device for cleaning a wafer using the same are provided. The wafer cleaning device includes a heater chuck on which a wafer is mounted, the heater chuck configured to heat a bottom surface of the wafer; a chemical liquid nozzle configured to spray a chemical liquid on a top surface of the wafer for etching; and a spot heater configured to heat a spot of the top surface of the wafer.
Public/Granted literature
- US20180311764A1 SPOT HEATER AND DEVICE FOR CLEANING WAFER USING THE SAME Public/Granted day:2018-11-01
Information query
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