公开(公告)号：US09999957B2

公开(公告)日：2018-06-19

申请号：US15001410

申请日：2016-01-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Yun-Seok Choi ,  Chang-Gil Ryu ,  Geun-Young Song ,  Ki-Yeon Chu ,  Jin-Suk Hong

IPC: B24B37/32 ,  B24B55/02 ,  B24B37/30

CPC classification number: B24B37/32 ,  B24B37/30 ,  B24B55/02

Abstract: A polishing head includes a substrate carrier to suck and to pressurize a substrate, and a retainer ring secured under the substrate carrier, the retainer ring surrounding a circumference of the substrate and including a cooling channel therethrough to circulate a coolant fluid.

公开(公告)号：US10576582B2

公开(公告)日：2020-03-03

申请号：US16029828

申请日：2018-07-09

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young-Hoo Kim ,  Il-Sang Lee ,  Yong-sun Ko ,  Chang-Gil Ryu ,  Kun-Tack Lee ,  Hyo-San Lee

IPC: H01L21/00 ,  B23K26/146 ,  B08B7/00 ,  B08B3/10 ,  C11D11/00 ,  H01L21/67 ,  H01L21/687

Abstract: A spot heater and a device for cleaning a wafer using the same are provided. The wafer cleaning device includes a heater chuck on which a wafer is mounted, the heater chuck configured to heat a bottom surface of the wafer; a chemical liquid nozzle configured to spray a chemical liquid on a top surface of the wafer for etching; and a spot heater configured to heat a spot of the top surface of the wafer.

公开(公告)号：US10340158B2

公开(公告)日：2019-07-02

申请号：US15058277

申请日：2016-03-02

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Eun-Seok Lee ,  Chang-Gil Ryu ,  Geun-Young Song ,  Jae-Chang Lee ,  Yun-Seok Choi ,  Jin-Suk Hong

IPC: H01L21/67 ,  B08B3/10 ,  B08B1/04 ,  B08B3/02 ,  B05B1/20 ,  B05B13/04 ,  B08B1/00

Abstract: Provided is a substrate cleaning apparatus including: a cleaning bath configured to accommodate a substrate having a first surface and a second surface; a substrate support configured to support the substrate; first and second nozzle bars provided in the cleaning bath to be rotatable in a plane parallel with the substrate, each of the first and the second nozzle bars including a passage; a plurality of nozzles provided along a longitudinal direction of each of the first and the second nozzle bars and configured to spray the cleaning solution from the passage of each of the first and the second nozzle bars to the substrate; and first and second brushes, the first brush provided on a first side of the substrate and configured to clean the first surface and the second brush provided on a second side of the substrate and configured to clean the second surface of the substrate.

公开(公告)号：US10029332B2

公开(公告)日：2018-07-24

申请号：US14706546

申请日：2015-05-07

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Young-Hoo Kim ,  Il-Sang Lee ,  Yong-sun Ko ,  Chang-Gil Ryu ,  Kun-Tack Lee ,  Hyo-San Lee

IPC: H01L21/00 ,  B23K26/146 ,  B08B7/00 ,  B08B3/10 ,  C11D11/00 ,  H01L21/67 ,  H01L21/687

Abstract: A spot heater and a device for cleaning a wafer using the same are provided. The wafer cleaning device includes a heater chuck on which a wafer is mounted, the heater chuck configured to heat a bottom surface of the wafer; a chemical liquid nozzle configured to spray a chemical liquid on a top surface of the wafer for etching; and a spot heater configured to heat a spot of the top surface of the wafer.