- Patent Title: User protection from thermal hot spots through device skin morphing
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Application No.: US16089029Application Date: 2016-03-28
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Publication No.: US10585464B2Publication Date: 2020-03-10
- Inventor: Hong W. Wong , Wah Yiu Kwong , Cheong W. Wong , Vivek M. Paranjape , Chia-Hung S. Kuo
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Jordan IP Law, LLC
- International Application: PCT/US2016/024410 WO 20160328
- International Announcement: WO2017/171697 WO 20171005
- Main IPC: G06F1/20
- IPC: G06F1/20 ; H04M1/02 ; H05K5/02 ; G06F1/16 ; H05K7/20

Abstract:
Systems, apparatuses and methods may provide for a thermal protection apparatus comprising a substrate including surfaces defining one or more channels and an array of openings adjacent to the one or more channels and an outer layer coupled to the substrate. The outer layer may include a plurality of opaque elastic regions positioned adjacent to the array of openings. Additionally, a fluid may be positioned within the one or more channels. In one example, the plurality of opaque elastic regions are expandable to become protrusions including one or more of a rectangular shape, a donut shape or a dome shape.
Public/Granted literature
- US20190121408A1 USER PROTECTION FROM THERMAL HOT SPOTS THROUGH DEVICE SKIN MORPHING Public/Granted day:2019-04-25
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