Invention Grant
- Patent Title: Substrate processing method and computer storage medium
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Application No.: US15763529Application Date: 2016-10-20
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Publication No.: US10586711B2Publication Date: 2020-03-10
- Inventor: Makoto Muramatsu , Tadatoshi Tomita , Hisashi Genjima , Takahiro Kitano
- Applicant: Tokyo Electron Limited
- Applicant Address: JP Tokyo
- Assignee: Tokyo Electron Limited
- Current Assignee: Tokyo Electron Limited
- Current Assignee Address: JP Tokyo
- Agency: Posz Law Group, PLC
- Priority: JP2015-208718 20151023
- International Application: PCT/JP2016/081118 WO 20161020
- International Announcement: WO2017/069203 WO 20170427
- Main IPC: H01L21/311
- IPC: H01L21/311 ; G03F7/16 ; G03F7/20 ; G03F7/30 ; G03F7/38 ; G03F7/42 ; H01L21/027 ; H01L21/67
Abstract:
A substrate processing method of processing a substrate using a block copolymer containing a hydrophilic polymer and a hydrophobic polymer, the substrate processing method includes: a block copolymer coating step of applying the block copolymer onto the substrate on which a predetermined projecting and recessed pattern is formed, to form a coating film of the block copolymer; a polymer separation step of phase-separating the block copolymer into the hydrophilic polymer and the hydrophobic polymer; a polymer removal step of selectively removing the hydrophilic polymer from the phase-separated block copolymer; and after the block copolymer coating step and before the polymer removal step, a film thickness reduction step of reducing a film thickness of the coating film of the block copolymer.
Public/Granted literature
- US20180269072A1 SUBSTRATE PROCESSING METHOD AND COMPUTER STORAGE MEDIUM Public/Granted day:2018-09-20
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