Invention Grant
- Patent Title: Electrical contacts on the sidewall of a circuit board
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Application No.: US15828126Application Date: 2017-11-30
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Publication No.: US10587060B2Publication Date: 2020-03-10
- Inventor: Todd E. Takken , Xin Zhang , Yuan Yao , Andrew Ferencz , Paul W. Coteus
- Applicant: International Business Machines Corporation
- Applicant Address: US NY Armonk
- Assignee: International Business Machines Corporation
- Current Assignee: International Business Machines Corporation
- Current Assignee Address: US NY Armonk
- Agency: Patterson + Sheridan, LLP
- Main IPC: H01R12/52
- IPC: H01R12/52 ; H01R12/57 ; H01R43/16 ; H05K1/11 ; H05K3/40 ; H05K1/14 ; H01R12/51

Abstract:
Printed circuit board (PCB), electrical structures including PCBs, and methods for making the same. One PCB structures includes: a substrate having a plurality of surfaces, including a first aerial main face (AMF), a second AMF, and a first peripheral end face (PEF), wherein the first PEF separates the first AMF from the second AMF, and a first plurality of contacts embedded in the first PEF, where each of the first plurality of contacts forms a contiguous contact with the first PEF and at least one of i) the second AMF, ii) the first AMF, and iii) another one of the plurality of surfaces.
Public/Granted literature
- US20190165501A1 ELECTRICAL CONTACTS ON THE SIDEWALL OF A CIRCUIT BOARD Public/Granted day:2019-05-30
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