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公开(公告)号：US20220270807A1
公开(公告)日：2022-08-25
申请号：US17174453
申请日：2021-02-12
摘要： Embodiment of the present invention includes a magnetic structure and a magnetic structure used in a direct current (DC) to DC energy converter. The magnetic structure has an E-core and a plate, with the plate positioned in contact or in near contact with the post surfaces of the E-core. The E-core has a base, a no-winding leg, a transformer leg, and an inductor leg. The no-winding leg, the transformer leg, and the inductor leg are perpendicular and magnetically in contact with the base. The plate is a flat slab with lateral dimensions generally larger than its thickness. The plate has a plate nose that overlaps a top no-winding leg surface of the no-winding leg with a no-winding gap area to form a no-winding gap with a no-winding gap reluctance. The plate also has a plate end that overlaps a top inductor leg surface of the inductor leg with an inductor gap area to form an inductor gap with an inductor gap reluctance. In some embodiments, e.g., where the duty cycle is less than 50 percent, the inductor gap reluctance will be designed to be less than the no-winding gap reluctance. In these cases, the majority of the magnetic flux that passes through the transformer leg will return through the inductor leg, instead of through the no-winding leg. The inductor and no-winding gap reluctances can he adjusted, so that the electromotive force applied to a charge passing through the inductor will partially cancel the electromotive force applied by the transformer secondary. The gap reluctance ratio can be defined, so that the difference in secondary and inductor electromotive forces is equal to the output voltage defined by an optimal no-ripple duty cycle. In this way no changing current is required through the inductor to create a dI/dt inductive voltage drop across the output inductor. Zero output current ripple is achieved.
Various embodiments of the plate, plate shape, and no-winding leg are disclosed. These embodiments allow achieving a high ratio of no-winding gap reluctance to inductor gap reluctance, for practical, affordable magnetic material structures and aspect ratios. A high gap reluctance ratio enables zero output current ripple for the high transformer turns ratios that are needed to achieve high input to output voltage ratios. The embodiments therefore allow achieving low output current ripple for 48 V or higher input voltages, 1 V or lower output voltages, and high output currents.-
公开(公告)号：US11056413B2
公开(公告)日：2021-07-06
申请号：US16417845
申请日：2019-05-21
发明人： Xin Zhang , Todd Takken , Shurong Tian , Yuan Yao
IPC分类号： H01L49/02 , H01L23/64 , H01L23/367
摘要： An inductor includes a conductor having a first end and a second end, wherein the first end, the second end, or both ends are configured to be mounted on a substrate and configured to receive a heat flow; and one or more magnetic cores surrounding a first portion of the conductor, the first portion of the conductor being intermediate the first end and the second end of the conductor. A second portion of the conductor not surrounded by the one or more magnetic cores is configured to transfer the heat flow from the conductor.
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公开(公告)号：US20210193557A1
公开(公告)日：2021-06-24
申请号：US16720599
申请日：2019-12-19
发明人： Yuan Yao , Shurong Tian , Todd Edward Takken
IPC分类号： H01L23/40 , H05K1/18 , H01R13/639
摘要： In an apparatus for coupling integrated circuits to printed circuit boards, a backing plate with manufactured features on the top surface includes a module lid; a planar structure; a device seated in the planar structure, with the module lid in contact with the top surface of the device; and a backing plate that contains manufactured features on one side. The backing plate is in contact with the planar structure, and a plurality of fastening mechanisms couple together the lid, the device, the planar structure, and the backing plate.
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公开(公告)号：US20190357354A1
公开(公告)日：2019-11-21
申请号：US16528908
申请日：2019-08-01
发明人： Todd E. Takken , Xin Zhang , Yuan Yao , Andrew Ferencz
摘要： A printed circuit board (PCB) structure and mounting assembly for joining two PCBs. A first PCB has a top and bottom surface faces and a peripheral end face separating the top and bottom surface. The first PCB has one or more conductive wire ends exposed at a surface of the peripheral end face; the exposed conductive wire ends forming multiple separate electrical contacts across the thickness and length of the PEF surface. A second PCB has a top surface face and one or more conductive pads exposed at the top surface at locations corresponding to locations of the multiple electrical contacts. A surface mount solder material is disposed on one or more exposed conductive pads for electrically connecting with corresponding the multiple electrical contacts. The disposed solder material stably joins the PEF surface of the first PCB to the top surface of the second PCB in a relative perpendicular orientation.
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公开(公告)号：US10321564B2
公开(公告)日：2019-06-11
申请号：US15808786
申请日：2017-11-09
发明人： Todd E. Takken , Xin Zhang , Yuan Yao , Andrew Ferencz
摘要： A printed circuit board (PCB) and PCB assembly. The PCB is formed of a laminate substrate of at least two layers of a non-conductive material forming at least one peripheral end face (PEF) surface separating top and bottom PCB surfaces. Embedded conductive wiring at one or more multiple layers carry energy to or from PCB surface mounted devices. The conductive wiring provides multiple conductive wire ends exposed at multiple locations along the PEF. A conductive contact structure is formed at the PEF surface to connect with one or more of the exposed conductive wire ends. One or more conductive pins are attached to the conductive contact at the PEF and are configured to mount the PCB on, and in a vertical and perpendicular orientation or a coplanar orientation relative to, a surface of a second PCB surface. The conductive pins provide one or more of: an electrical, thermal and/or mechanical contact.
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公开(公告)号：US20190141830A1
公开(公告)日：2019-05-09
申请号：US15808797
申请日：2017-11-09
发明人： Todd E. Takken , Xin Zhang , Yuan Yao , Andrew Ferencz
CPC分类号： H05K1/0298 , H05K1/117 , H05K3/366 , H05K3/403 , H05K13/04 , H05K2201/09145 , H05K2201/0919
摘要： A printed circuit board (PCB) structure and mounting assembly for joining two PCBs. A first PCB has a top and bottom surface faces and a peripheral end face separating the top and bottom surface. The first PCB has one or more conductive wire ends exposed at a surface of the peripheral end face; the exposed conductive wire ends forming multiple separate electrical contacts across the thickness and length of the PEF surface. A second PCB has a top surface face and one or more conductive pads exposed at the top surface at locations corresponding to locations of the multiple electrical contacts. A surface mount solder material is disposed on one or more exposed conductive pads for electrically connecting with corresponding the multiple electrical contacts. The disposed solder material stably joins the PEF surface of the first PCB to the top surface of the second PCB in a relative perpendicular orientation.
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公开(公告)号：US20190141829A1
公开(公告)日：2019-05-09
申请号：US15808786
申请日：2017-11-09
发明人： Todd E. Takken , Xin Zhang , Yuan Yao , Andrew Ferencz
摘要： A printed circuit board (PCB) and PCB assembly. The PCB is formed of a laminate substrate of at least two layers of a non-conductive material forming at least one peripheral end face (PEF) surface separating top and bottom PCB surfaces. Embedded conductive wiring at one or more multiple layers carry energy to or from PCB surface mounted devices. The conductive wiring provides multiple conductive wire ends exposed at multiple locations along the PEF. A conductive contact structure is formed at the PEF surface to connect with one or more of the exposed conductive wire ends. One or more conductive pins are attached to the conductive contact at the PEF and are configured to mount the PCB on, and in a vertical and perpendicular orientation or a coplanar orientation relative to, a surface of a second PCB surface. The conductive pins provide one or more of: an electrical, thermal and/or mechanical contact.
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公开(公告)号：US11799374B2
公开(公告)日：2023-10-24
申请号：US17476586
申请日：2021-09-16
发明人： Xin Zhang , Todd Edward Takken , Yuan Yao
CPC分类号： H02M3/003 , H05K1/181 , H05K3/303 , H05K2201/10325 , H05K2201/10719
摘要： A package structure is disclosed. The package structure includes processor die connected to a top surface of a package substrate. The package structure further includes a DC-DC power converter attached to a bottom surface of the package substrate. The DC-DC power converter is located at least within an open area of an interconnect component that connects the bottom surface of the package substrate and a top surface of a motherboard.
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公开(公告)号：US20230198177A1
公开(公告)日：2023-06-22
申请号：US17555346
申请日：2021-12-17
发明人： Xin Zhang , Todd Edward Takken , Yuan Yao , Andrew Ferencz
CPC分类号： H01R12/62 , H05K1/111 , H05K3/321 , H05K2201/10356 , H05K2201/10984
摘要： A semiconductor package provides a low profile connection to a bottom side of the semi-conductor package. The semi-conductor package includes a computer processor die and a substrate. The computer processor die is mounted on to a top surface of the substrate. The substrate is mounted on to a printed circuit board. A voltage regulator is coupled to the printed circuit board. A top surface of the voltage regulator is coupled to a bottom surface of the substrate. The package also includes a connector device. The connector device includes a cable configured to conduct power from an upstream source, and a low-profile connector module attached to an end of the cable. The connector module is configured to interface to a bottom surface of the voltage regulator.
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公开(公告)号：US20200373217A1
公开(公告)日：2020-11-26
申请号：US16417845
申请日：2019-05-21
发明人： Xin Zhang , Todd Takken , Shurong Tian , Yuan Yao
IPC分类号： H01L23/367 , H01L23/64 , H01L49/02
摘要： An inductor includes a conductor having a first end and a second end, wherein the first end, the second end, or both ends are configured to be mounted on a substrate and configured to receive a heat flow; and one or more magnetic cores surrounding a first portion of the conductor, the first portion of the conductor being intermediate the first end and the second end of the conductor. A second portion of the conductor not surrounded by the one or more magnetic cores is configured to transfer the heat flow from the conductor.
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