Invention Grant
- Patent Title: Techniques for combining CMP process tracking data with 3D printed CMP consumables
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Application No.: US14935134Application Date: 2015-11-06
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Publication No.: US10593574B2Publication Date: 2020-03-17
- Inventor: Jason G. Fung , Rajeev Bajaj , Daniel Redfield , Aniruddh Khanna , Mario Cornejo , Gregory E. Menk , John Watkins
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan LLP
- Main IPC: B24B37/013
- IPC: B24B37/013 ; H01L21/67 ; B29C64/106 ; B33Y10/00 ; B33Y80/00 ; B24B37/26 ; B24B49/00 ; B24B49/10 ; B24B49/14 ; B24B49/16 ; H01L21/306 ; H01L21/66 ; B29L31/00
Abstract:
Chemical mechanical polishing (CMP) apparatus and methods for manufacturing CMP apparatus are provided herein. CMP apparatus may include polishing pads, polishing head retaining rings, and polishing head membranes, among others, and the CMP apparatus may be manufactured via additive manufacturing processes, such as three dimensional (3D) printing processes. The CMP apparatus may include wireless communication apparatus components integrated therein. Methods of manufacturing CMP apparatus include 3D printing wireless communication apparatus into a polishing pad and printing a polishing pad with a recess configured to receive a preformed wireless communication apparatus.
Public/Granted literature
- US20170133252A1 TECHNIQUES FOR COMBINING CMP PROCESS TRACKING DATA WITH 3D PRINTED CMP CONSUMABLES Public/Granted day:2017-05-11
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