Invention Grant
- Patent Title: Actuatable and adaptable metamaterials integrated in package
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Application No.: US15283140Application Date: 2016-09-30
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Publication No.: US10594029B2Publication Date: 2020-03-17
- Inventor: Shawna M. Liff , Adel A. Elsherbini , Sasha N. Oster , Feras Eid , Georgios C. Dogiamis , Thomas L. Sounart , Johanna M. Swan
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01Q1/52
- IPC: H01Q1/52 ; H01L41/09 ; H01L41/047 ; H04L29/06 ; H01Q1/27 ; H04W12/12 ; H04L29/08 ; H01Q15/00 ; H04W12/00

Abstract:
Embodiments of the invention include a reconfigurable communication system, that includes a substrate and a metamaterial shield formed over the substrate. In an embodiment, the metamaterial shield surrounds one or more components on the substrate. Additionally, a plurality of first piezoelectric actuators may be formed on the substrate. The first piezoelectric actuators may be configured to deform the metamaterial shield and change a frequency band that is permitted to pass through the metamaterial shield. Embodiments may also include a reconfigurable antenna that includes a metamaterial. In an embodiment, a plurality of second piezoelectric actuators may be configured to deform the metamaterial of the antenna and change a central operating frequency of the antenna. Embodiments may also include an integrated circuit electrically coupled to the plurality of first piezoelectric actuators and second piezoelectric actuators.
Public/Granted literature
- US20180097284A1 ACTUATABLE AND ADAPTABLE METAMATERIALS INTEGRATED IN PACKAGE Public/Granted day:2018-04-05
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