Invention Grant
- Patent Title: Apparatus and method for bending a substrate
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Application No.: US16588447Application Date: 2019-09-30
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Publication No.: US10600658B2Publication Date: 2020-03-24
- Inventor: Andre Wedi , Guido Boenig , Niels Oeschler , Christian Stahlhut
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Murphy, Bilak & Homiller, PLLC
- Priority: EP17178590 20170629
- Main IPC: H01L21/48
- IPC: H01L21/48 ; H01L23/373 ; H01L23/492 ; H01L23/00
Abstract:
A method includes placing a substrate on a first curved surface of a first bending tool, using a second bending tool with a second surface to apply pressure to the substrate, thereby pressing the substrate onto the first curved surface and bending the substrate, and removing the bended substrate from the first bending tool.
Public/Granted literature
- US20200027752A1 Apparatus and Method for Bending a Substrate Public/Granted day:2020-01-23
Information query
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