- 专利标题： Semiconductor package having junction cooling pipes embedded in substrates
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申请号： US15714539申请日： 2017-09-25
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公开(公告)号： US10607919B2公开(公告)日： 2020-03-31
- 发明人: Seungwon Im , Oseob Jeon , Byoungok Lee , Yoonsoo Lee , Joonseo Son , Dukyong Lee , Changyoung Park
- 申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- 申请人地址： US AZ Phoenix
- 专利权人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- 当前专利权人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- 当前专利权人地址： US AZ Phoenix
- 代理机构： Adam R. Stephenson, LTD.
- 主分类号： H01L23/433
- IPC分类号： H01L23/433 ; H01L23/13 ; H01L23/498 ; H01L25/065 ; H01L23/473 ; H01L23/495 ; H01L23/24
摘要：
Implementations of semiconductor packages may include a first substrate coupled to a first die, a second substrate coupled to a second die, and a spacer included within a perimeter of the first substrate and within a perimeter of a second substrate, the spacer coupled between the first die and the second die, the spacer include a junction cooling pipe therethrough.
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