公开(公告)号：US11967540B2

公开(公告)日：2024-04-23

申请号：US17457100

申请日：2021-12-01

申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

发明人： Seungwon Im ,  Oseob Jeon ,  Byoungok Lee ,  Yoonsoo Lee ,  Joonseo Son ,  Dukyong Lee ,  Changyoung Park

IPC分类号： H01L25/065 ,  H01L23/13 ,  H01L23/433 ,  H01L23/473 ,  H01L23/495 ,  H01L23/498 ,  H01L23/24

CPC分类号： H01L23/433 ,  H01L23/13 ,  H01L23/4334 ,  H01L23/473 ,  H01L23/49568 ,  H01L23/49861 ,  H01L25/0657 ,  H01L23/24 ,  H01L2224/33

摘要： Implementations of semiconductor packages may include a first substrate coupled to a first die, a second substrate coupled to a second die, and a spacer included within a perimeter of the first substrate and within a perimeter of a second substrate, the spacer coupled between the first die and the second die, the spacer include a junction cooling pipe therethrough.

公开(公告)号：US11201105B2

公开(公告)日：2021-12-14

申请号：US16790933

申请日：2020-02-14

申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

发明人： Seungwon Im ,  Oseob Jeon ,  Byoungok Lee ,  Yoonsoo Lee ,  Joonseo Son ,  Dukyong Lee ,  Changyoung Park

IPC分类号： H01L23/433 ,  H01L23/13 ,  H01L23/498 ,  H01L25/065 ,  H01L23/473 ,  H01L23/495 ,  H01L23/24

摘要： Implementations of semiconductor packages may include a first substrate coupled to a first die, a second substrate coupled to a second die, and a spacer included within a perimeter of the first substrate and within a perimeter of a second substrate, the spacer coupled between the first die and the second die, the spacer include a junction cooling pipe therethrough.

公开(公告)号：US10607919B2

公开(公告)日：2020-03-31

申请号：US15714539

申请日：2017-09-25

申请人： SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC

发明人： Seungwon Im ,  Oseob Jeon ,  Byoungok Lee ,  Yoonsoo Lee ,  Joonseo Son ,  Dukyong Lee ,  Changyoung Park

IPC分类号： H01L23/433 ,  H01L23/13 ,  H01L23/498 ,  H01L25/065 ,  H01L23/473 ,  H01L23/495 ,  H01L23/24

摘要： Implementations of semiconductor packages may include a first substrate coupled to a first die, a second substrate coupled to a second die, and a spacer included within a perimeter of the first substrate and within a perimeter of a second substrate, the spacer coupled between the first die and the second die, the spacer include a junction cooling pipe therethrough.