Invention Grant
- Patent Title: Vertical 2T-2C memory cells and memory arrays
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Application No.: US16183528Application Date: 2018-11-07
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Publication No.: US10607994B2Publication Date: 2020-03-31
- Inventor: Scott J. Derner , Michael Amiel Shore
- Applicant: Micron Technology, Inc.
- Applicant Address: US ID Boise
- Assignee: Micron Technology, Inc.
- Current Assignee: Micron Technology, Inc.
- Current Assignee Address: US ID Boise
- Agency: Wells St. John P.S.
- Main IPC: H01L27/108
- IPC: H01L27/108 ; G11C11/403 ; H01L27/07 ; H01L49/02 ; H01L29/78 ; G11C7/18 ; H01L23/528 ; H01L29/08 ; H01L29/10

Abstract:
Some embodiments include a memory cell having first and second transistors and first and second capacitors. The first capacitor is vertically displaced relative to the first transistor. The first capacitor has a first node electrically coupled with a source/drain region of the first transistor, a second node electrically coupled with a common plate structure, and a first capacitor dielectric material between the first and second nodes. The second capacitor is vertically displaced relative to the second transistor. The second capacitor has a third node electrically coupled with a source/drain region of the second transistor, a fourth node electrically coupled with the common plate structure, and a second capacitor dielectric material between the first and second nodes. Some embodiments include memory arrays having 2T-2C memory cells.
Public/Granted literature
- US20190088653A1 Memory Cells and Memory Arrays Public/Granted day:2019-03-21
Information query
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