Invention Grant
- Patent Title: System and method for intelligent data/frame compression in a system on a chip
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Application No.: US15490620Application Date: 2017-04-18
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Publication No.: US10609418B2Publication Date: 2020-03-31
- Inventor: Serag Gadelrab , Chinchuan Chiu , Moinul Khan , Kyle Ernewein , Tom Longo , Simon Booth , Meghal Varia , Milivoje Aleksic
- Applicant: QUALCOMM INCORPORATED
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Smith Tempel Blaha LLC/Qualcomm
- Main IPC: H04N19/85
- IPC: H04N19/85 ; H04N19/103 ; H04N19/176 ; H04N19/156 ; H04N19/172 ; H04N19/146 ; H04N19/152 ; H04N19/117

Abstract:
An exemplary method for intelligent compression defines a threshold value for a temperature reading generated by a temperature sensor. Data blocks received into the compression module are compressed according to either a first mode or a second mode, the selection of which is determined based on a comparison of the active level for the temperature reading to the defined threshold value. The first compression mode may be associated with a lossless compression algorithm while the second compression mode is associated with a lossy compression algorithm. Or, both the first compression mode and the second compression mode may be associated with a lossless compression algorithm, however, for the first compression mode the received data blocks are produced at a default high quality level setting while for the second compression mode the received data blocks are produced at a reduced quality level setting.
Public/Granted literature
- US20180302624A1 SYSTEM AND METHOD FOR INTELLIGENT DATA/FRAME COMPRESSION IN A SYSTEM ON A CHIP Public/Granted day:2018-10-18
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