Invention Grant
- Patent Title: Thin film and method for manufacturing the same and copper clad laminate
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Application No.: US15858424Application Date: 2017-12-29
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Publication No.: US10654969B2Publication Date: 2020-05-19
- Inventor: Meng-Hsin Chen , Chih-Hsiang Lin , Jen-Chun Chiu
- Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Applicant Address: TW Hsinchu
- Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4b8941c6
- Main IPC: C08G63/02
- IPC: C08G63/02 ; C08J5/18 ; B32B27/36 ; B32B15/09 ; C08G63/06

Abstract:
A thin film is provided, which includes a polymer formed by reacting (a) p-hydroxybenzoic acid, (b) 6-hydroxy 2-naphthoic acid and (c) branched-monomer. (c) branched-monomer is or a combination thereof, wherein R is aryl group, heteroaryl group, or cycloalkyl group, and each of R1 is independently —OH, —NH2, or —COOH. The molar ratio of (a) p-hydroxybenzoic acid over (b) 6-hydroxy 2-naphthoic acid is between 50:50 and 90:10. The molar ratio of (c) branched-monomer over the sum of (a) p-hydroxybenzoic acid and (b) 6-hydroxy 2-naphthoic acid is between 0.25:100 and 0.5:100. The polymer has an intrinsic viscosity of 4 dL/g to 6 dL/g.
Public/Granted literature
- US20180237582A1 THIN FILM AND METHOD FOR MANUFACTURING THE SAME AND COPPER CLAD LAMINATE Public/Granted day:2018-08-23
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