Various embodiments relate to a semiconductor package structure. The semiconductor package structure includes a first chip having a first surface and a second surface opposite the first surface. The semiconductor package structure further includes a supporter surrounding an edge of the first chip, and the supporter includes a recessed portion. The semiconductor package structure further includes a conductive layer disposed over the first surface of the first chip and electrically connected to the first chip. The semiconductor package structure further includes an insulation layer disposed over the first surface of the first chip. The semiconductor package structure further includes an encapsulant between the first chip and the supporter and surrounding at least the edge of the first chip.