Invention Grant
- Patent Title: Plasma treatment for multilayer adhesive bonding element
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Application No.: US15783527Application Date: 2017-10-13
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Publication No.: US10662350B2Publication Date: 2020-05-26
- Inventor: Marcel Hähnel , Jennifer Kipke , CHristoph Nagel , Jannik Sellin
- Applicant: TESA SE
- Applicant Address: DE Norderstedt
- Assignee: TESA SE
- Current Assignee: TESA SE
- Current Assignee Address: DE Norderstedt
- Agency: Norris McLaughlin, P.A.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@28d988bd
- Main IPC: C09J5/00
- IPC: C09J5/00 ; H02K3/30 ; B32B7/12 ; B28B19/00 ; B32B37/26 ; H01M2/02 ; C09J7/20 ; C23C14/00 ; C23C16/00 ; B32B38/00 ; C09J5/02 ; H01B7/02 ; H02K3/40 ; C09J7/25 ; C09J133/10 ; C09J153/02 ; C09J183/00 ; C08K7/02

Abstract:
Method for bonding by wrapping a medium which is capable of expanding transversely to a winding with an adhesive tape, in which: an adhesive tape is unrolled from an adhesive tape roll, the unrolled adhesive tape is provided on one side of a carrier film (1) with an adhesive cement layer (2) and on an opposite side with a separating agent layer (3), the separating agent layer (3) is subjected to a plasma treatment, the plasma-treated adhesive tape is wound around the medium which is capable of expanding transversely to a winding, so that at least a portion of the adhesive tape is bonded to a lower winding ply by the adhesive cement layer (2).
Public/Granted literature
- US20180112107A1 PLASMA TREATMENT FOR MULTILAYER ADHESIVE BONDING ELEMENT Public/Granted day:2018-04-26
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