Invention Grant
- Patent Title: Semiconductor processing apparatus and semiconductor processing method
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Application No.: US16059213Application Date: 2018-08-09
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Publication No.: US10672640B2Publication Date: 2020-06-02
- Inventor: Junichi Igarashi
- Applicant: TOSHIBA MEMORY CORPORATION
- Applicant Address: JP Minato-ku
- Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee: TOSHIBA MEMORY CORPORATION
- Current Assignee Address: JP Minato-ku
- Agency: Oblon, McClelland, Maier & Neustadt, L.L.P.
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@339f4039
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L21/687 ; B05B13/02 ; B05C11/02 ; B05C11/10 ; H01L21/67

Abstract:
A semiconductor processing apparatus according to the present embodiment is provided with a stage capable of placing a semiconductor substrate thereon and of rotating the semiconductor substrate. A plurality of holders are provided on the stage, to hold an edge of the semiconductor substrate. A plurality of sensors are provided to the plurality of holders, respectively, to detect the edge of the semiconductor substrate. An elevator mechanism is capable of changing heights of the holders. A controller controls the elevator mechanism to change the heights of the holders so that the plurality of sensors detect the edge of the semiconductor substrate.
Public/Granted literature
- US20190252236A1 SEMICONDUCTOR PROCESSING APPARATUS AND SEMICONDUCTOR PROCESSING METHOD Public/Granted day:2019-08-15
Information query
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