Invention Grant
- Patent Title: Pressure sensor module having a sensor chip and passive devices within a housing
-
Application No.: US16114543Application Date: 2018-08-28
-
Publication No.: US10677675B2Publication Date: 2020-06-09
- Inventor: Mathias Vaupel , Matthias Boehm , Steven Gross , Markus Loehndorf , Stephan Schmitt , Horst Theuss , Helmut Wietschorke
- Applicant: Infineon Technologies AG
- Applicant Address: DE Neubiberg
- Assignee: Infineon Technologies AG
- Current Assignee: Infineon Technologies AG
- Current Assignee Address: DE Neubiberg
- Agency: Dicke, Billig & Czaja, PLLC
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4e78bd92
- Main IPC: G01L9/12
- IPC: G01L9/12 ; G01L19/14 ; G01L19/00
Abstract:
A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.
Public/Granted literature
- US20180364123A1 PRESSURE SENSOR MODULE HAVING A SENSOR CHIP AND PASSIVE DEVICES WITHIN A HOUSING Public/Granted day:2018-12-20
Information query
