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    Apparatus for redundantly measuring a magnetic field
    4.
    发明授权
    Apparatus for redundantly measuring a magnetic field 有权

    公开(公告)号：US10324143B2

    公开(公告)日：2019-06-18

    申请号：US15472343

    申请日：2017-03-29

    Applicant: Infineon Technologies AG

    Inventor： Berthold Astegher ,  Helmut Wietschorke

    IPC: G01R33/07 ,  G01R33/09 ,  A61B90/00

    Abstract: In various embodiments, a Hall sensor arrangement for the redundant measurement of a magnetic field may include a first Hall sensor on a top side of a first semiconductor substrate; a second Hall sensor on a top side of a second semiconductor substrate; a carrier having a top side and an underside; wherein the first Hall sensor is arranged on the top side of the carrier and the second Hall sensor is arranged on the underside of the carrier; and wherein the measuring area of the first Hall sensor projected perpendicularly onto the carrier at least partly overlaps the measuring area of the second Hall sensor projected perpendicularly onto the carrier.

    MOLDED SEMICONDUCTOR PACKAGE HAVING ENHANCED LOCAL ADHESION CHARACTERISTICS
    6.
    发明申请
    MOLDED SEMICONDUCTOR PACKAGE HAVING ENHANCED LOCAL ADHESION CHARACTERISTICS 审中-公开
    具有增强的本地粘合特性的模制半导体封装

    公开(公告)号：US20160282212A1

    公开(公告)日：2016-09-29

    申请号：US14667858

    申请日：2015-03-25

    Applicant: Infineon Technologies AG

    Inventor： Sebastian Beer ,  Helmut Wietschorke ,  Jochen Dangelmaier ,  Horst Theuss ,  Bernhard Knott ,  Thomas Mueller ,  Andreas Allmeier

    IPC: G01L19/14 ,  H01L25/18 ,  H01L21/52 ,  H01L21/56 ,  H01L23/31 ,  H01L23/495

    CPC classification number: G01L19/147 ,  G01L19/0084 ,  H01L21/56 ,  H01L23/3107 ,  H01L23/3142 ,  H01L23/49551 ,  H01L23/49575 ,  H01L23/49586 ,  H01L25/18 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/00012

    Abstract: A molded semiconductor package includes a substrate having opposing first and second main surfaces, a semiconductor die attached to the first main surface of the substrate, an adhesion adapter attached to the second main surface of the substrate or a surface of the semiconductor die facing away from the substrate, and a mold compound encapsulating the semiconductor die, the adhesion adapter and at least part of the substrate. The adhesion adapter is configured to adapt adhesion properties of the mold compound to adhesion properties of the substrate or semiconductor die to which the adhesion adapter is attached, such that the mold compound more strongly adheres to the adhesion adapter than directly to the substrate or semiconductor die to which the adhesion adapter is attached. The adhesion adapter has a surface feature which strengthens the adhesion between the adhesion adapter and the mold compound.

    Abstract translation: 模制的半导体封装包括具有相对的第一和第二主表面的基板，附接到基板的第一主表面的半导体管芯，附接到基板的第二主表面的粘合适配器或半导体管芯的远离 衬底和封装半导体管芯，粘合适配器和至少部分衬底的模具化合物。 粘合适配器被配置成使得模制化合物的粘合性能适应于粘合适配器所附着的基底或半导体管芯的粘合性能，使得模制化合物比直接连接到基底或半导体模具更强烈地粘附到粘合适配器 附着适配器附接到该装置。 粘合适配器具有加强粘合适配器和模具化合物之间的粘附的表面特征。

    Pressure sensor package with integrated sealing
    7.
    发明授权
    Pressure sensor package with integrated sealing 有权
    压力传感器封装，集成密封

    公开(公告)号：US09366593B2

    公开(公告)日：2016-06-14

    申请号：US14039706

    申请日：2013-09-27

    Applicant: Infineon Technologies AG

    Inventor： Mathias Vaupel ,  Horst Theuss ,  Helmut Wietschorke

    IPC: G01L9/00 ,  B81B7/00 ,  B81C1/00 ,  G01L19/00

    CPC classification number: G01L9/0045 ,  B81B7/0048 ,  B81B2201/0264 ,  B81C1/00325 ,  G01L9/0042 ,  G01L9/0054 ,  G01L19/0007 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/1815 ,  H01L2924/00014

    Abstract: A pressure sensor package includes a lead and a semiconductor die spaced apart from the lead and including a terminal and a diaphragm disposed at a first side of the die. The die is configured to change an electrical parameter responsive to a pressure difference across the diaphragm. The package further includes an electrical conductor connecting the terminal to the lead, a molding compound encasing the electrical conductor, the die and part of the lead, a cavity in the molding compound exposing the diaphragm, and a sealing ring disposed on a side of the molding compound with the cavity. The sealing ring surrounds the cavity and has a lower elastic modulus than the molding compound. Alternatively, the sealing ring can be a ridge of the molding compound that protrudes from the side of the molding compound with the cavity and surrounds the cavity. A package manufacturing method is also provided.

    Abstract translation: 压力传感器封装包括引线和与引线间隔开的半导体管芯，并且包括设置在管芯第一侧的端子和隔膜。 模具被配置成响应于横跨隔膜的压差而改变电参数。 该封装还包括将端子连接到引线的电导体，封装电导体，模具和引线的一部分的模制化合物，暴露隔膜的模制化合物中的空腔，以及设置在该导体的侧面上的密封环 与空腔成型。 密封环围绕腔体并具有比模塑料更低的弹性模量。 或者，密封环可以是模制化合物的脊，其从模制化合物与空腔的侧面突出并且包围空腔。 还提供了一种封装制造方法。

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