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公开(公告)号：US20200370983A1
公开(公告)日：2020-11-26
申请号：US16896628
申请日：2020-06-09
Applicant: Infineon Technologies AG
Inventor： Mathias Vaupel , Matthias Boehm , Steven Gross , Markus Loehndorf , Stephan Schmitt , Horst Theuss , Helmut Wietschorke
Abstract: A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.
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Patent Agency Ranking
公开(公告)号：US20180364123A1
公开(公告)日：2018-12-20
申请号：US16114543
申请日：2018-08-28
Applicant: Infineon Technologies AG
Inventor： Mathias Vaupel , Matthias Boehm , Steven Gross , Markus Loehndorf , Stephan Schmitt , Horst Theuss , Helmut Wietschorke
Abstract: A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.
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公开(公告)号：US10677675B2
公开(公告)日：2020-06-09
申请号：US16114543
申请日：2018-08-28
Applicant: Infineon Technologies AG
Inventor： Mathias Vaupel , Matthias Boehm , Steven Gross , Markus Loehndorf , Stephan Schmitt , Horst Theuss , Helmut Wietschorke
Abstract: A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.
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公开(公告)号：US10060819B2
公开(公告)日：2018-08-28
申请号：US14945661
申请日：2015-11-19
Applicant: Infineon Technologies AG
Inventor： Mathias Vaupel , Matthias Boehm , Steven Gross , Markus Loehndorf , Stephan Schmitt , Horst Theuss , Helmut Wietschorke
CPC classification number: G01L19/0084 , G01L19/147 , G01L19/148
Abstract: A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.
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公开(公告)号：US11287344B2
公开(公告)日：2022-03-29
申请号：US16896628
申请日：2020-06-09
Applicant: Infineon Technologies AG
Inventor： Mathias Vaupel , Matthias Boehm , Steven Gross , Markus Loehndorf , Stephan Schmitt , Horst Theuss , Helmut Wietschorke
Abstract: A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.
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6.发明申请PRESSURE SENSOR MODULE HAVING A SENSOR CHIP AND PASSIVE DEVICES WITHIN A HOUSING 审中-公开带传感器芯片的压力传感器模块和外壳中的被动设备公开(公告)号：US20160169763A1
公开(公告)日：2016-06-16
申请号：US14945661
申请日：2015-11-19
Applicant: Infineon Technologies AG
Inventor： Mathias Vaupel , Matthias Boehm , Steven Gross , Markus Loehndorf , Stephan Schmitt , Horst Theuss , Helmut Wietschorke
CPC classification number: G01L19/0084 , G01L19/147 , G01L19/148
Abstract: A pressure sensor module including a housing, a pressure sensor chip, and one or more of an integrated passive device (IDP) chip and discrete passive devices are disclosed. The pressure sensor chip and one or more of the IPD chip and the discrete passive devices are arranged within the housing.
Abstract translation: 公开了一种包括壳体，压力传感器芯片以及集成无源器件（IDP）芯片和分立无源器件中的一个或多个的压力传感器模块。 压力传感器芯片和一个或多个IPD芯片和分立无源器件布置在壳体内。
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