Invention Grant
- Patent Title: Modified resin systems suitable for liquid resin infusion
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Application No.: US16276800Application Date: 2019-02-15
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Publication No.: US10682791B2Publication Date: 2020-06-16
- Inventor: Jonathan E. Meegan , Olivia Denman , Marco Aurilia
- Applicant: Cytec Industries Inc.
- Applicant Address: US NJ Princeton
- Assignee: Cytec Industries Inc.
- Current Assignee: Cytec Industries Inc.
- Current Assignee Address: US NJ Princeton
- Agent Thi Dang
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@2ad17c82
- Main IPC: B32B27/38
- IPC: B32B27/38 ; B32B27/26 ; B32B27/20 ; B32B27/18 ; B32B27/04 ; C08L63/00 ; B29C35/02 ; B29C45/00 ; C08K3/01 ; C08G59/50 ; B29C45/14 ; B29C45/72 ; C08J5/24 ; B29C45/02 ; B29C70/44 ; B29C70/48 ; B29K63/00 ; B29K105/08 ; B29K105/16 ; B29K409/06 ; B29K509/08

Abstract:
A curable composition for liquid resin infusion (LRI) and a manufacturing process for producing a molded article. The curable composition includes: a) no more than 5.0 wt % of a thermoplastic polymer; b) no more than 5.0 wt % of nano-sized core-shell particles; c) no more than 5.0 wt % of nano-sized inorganic particles; d) an epoxy resin component; and e) one or more amine curing agent(s), wherein the initial viscosity of said curable composition is no more than 5 Poise at a temperature within the temperature range of from about 80° C. to about 130° C.
Public/Granted literature
- US20190176377A1 MODIFIED RESIN SYSTEMS SUITABLE FOR LIQUID RESIN INFUSION Public/Granted day:2019-06-13
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