- Patent Title: Systems and methods for dicing samples using a bessel beam matrix
-
Application No.: US15911389Application Date: 2018-03-05
-
Publication No.: US10707130B2Publication Date: 2020-07-07
- Inventor: Shih-Chi Chen , Hiu Hung Lee , Dapeng Zhang , Erxuan Zhao , Yina Chang , Dihan Chen
- Applicant: The Chinese University of Hong Kong
- Applicant Address: CN Hong Kong
- Assignee: The Chinese University of Hong Kong
- Current Assignee: The Chinese University of Hong Kong
- Current Assignee Address: CN Hong Kong
- Agency: Schwegman Lundberg & Woessner, P.A.
- Main IPC: B23K26/06
- IPC: B23K26/06 ; B23K26/03 ; B23K26/067 ; B23K26/38 ; B23K26/0622 ; B23K26/04 ; B23K26/14 ; B23K26/08 ; H01L21/78 ; H01L21/268 ; H01L21/67

Abstract:
Systems and methods for dicing a sample by a Bessel beam matrix are disclosed. The method for dicing a sample by a Bessel beam matrix may comprise generating a Bessel beam matrix including multiple Bessel beams arranged in a matrix form, according to a predetermined dicing layout of the sample; controlling a focus position of each Bessel beam in the generated Bessel beam matrix; and focusing simultaneously the Bessel beams of the Bessel beam matrix at the respective controlled focus positions within the sample for dicing.
Public/Granted literature
- US20190273025A1 SYSTEMS AND METHODS FOR DICING SAMPLES USING A BESSEL BEAM MATRIX Public/Granted day:2019-09-05
Information query
IPC分类: