Invention Grant
- Patent Title: MOSFET device of silicon carbide having an integrated diode and manufacturing process thereof
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Application No.: US16027060Application Date: 2018-07-03
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Publication No.: US10707202B2Publication Date: 2020-07-07
- Inventor: Mario Giuseppe Saggio , Simone Rascuná
- Applicant: STMICROELECTRONICS S.R.L.
- Applicant Address: IT Agrate Brianza
- Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee: STMICROELECTRONICS S.R.L.
- Current Assignee Address: IT Agrate Brianza
- Agency: Seed IP Law Group LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@29105c98
- Main IPC: H01L29/47
- IPC: H01L29/47 ; H01L27/06 ; H01L29/872 ; H01L29/06 ; H01L29/10 ; H01L29/16 ; H01L29/66 ; H01L29/78 ; H01L21/04 ; H01L29/08 ; H01L29/423

Abstract:
An integrated MOSFET device is formed in a body of silicon carbide and with a first type of conductivity. The body accommodates a first body region, with a second type of conductivity; a JFET region adjacent to the first body region; a first source region, with the first type of conductivity, extending into the interior of the first body region; an implanted structure, with the second type of conductivity, extending into the interior of the JFET region. An isolated gate structure lies partially over the first body region, the first source region and the JFET region. A first metallization layer extends over the first surface and forms, in direct contact with the implanted structure and with the JFET region, a JBS diode.
Public/Granted literature
- US20190013312A1 MOSFET DEVICE OF SILICON CARBIDE HAVING AN INTEGRATED DIODE AND MANUFACTURING PROCESS THEREOF Public/Granted day:2019-01-10
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