Invention Grant
- Patent Title: Molded product, electrical product, and method for manufacturing molded product
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Application No.: US16620286Application Date: 2018-07-19
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Publication No.: US10710288B2Publication Date: 2020-07-14
- Inventor: Seiichi Yamazaki , Toshihiro Higashikawa , Hitoshi Hirai
- Applicant: NISSHA CO., LTD.
- Applicant Address: JP Kyoto-Shi, Kyoto
- Assignee: NISSHA CO., LTD.
- Current Assignee: NISSHA CO., LTD.
- Current Assignee Address: JP Kyoto-Shi, Kyoto
- Agency: Alleman Hall Creasman & Tuttle LLP
- Priority: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@4bce18f7
- International Application: PCT/JP2018/027102 WO 20180719
- International Announcement: WO2019/026636 WO 20190207
- Main IPC: H05K3/10
- IPC: H05K3/10 ; H05K7/00 ; H05K7/02 ; H05K13/04 ; H01Q1/38 ; B29C45/14 ; H05K1/18 ; H05K3/32 ; B29L31/34 ; G06F3/041 ; H04N5/225

Abstract:
A molded product and an electrical product comprising a molded article that includes a main body made of resin and a standing wall made of resin. The standing wall integrally stands up from the end portion of the main body. A decorative sheet includes a base film and a conductive circuit layer. The base film continuously covers from the main body front surface to a wall front surface. The conductive circuit layer is disposed between the base film and the main body front surface. The decorative sheet is integrated with the molded article to implement a decoration with the base film. A flexible printed circuit board is disposed between the molded article and the conductive circuit layer. The flexible printed circuit board is partially embedded into and integrated with the standing wall. The flexible printed circuit board is electrically connected to the conductive circuit layer.
Public/Granted literature
- US20200101646A1 MOLDED PRODUCT, ELECTRICAL PRODUCT, AND METHOD FOR MANUFACTURING MOLDED PRODUCT Public/Granted day:2020-04-02
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