- 专利标题： Filter and capacitor using redistribution layer and micro bump layer
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申请号： US15946970申请日： 2018-04-06
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公开(公告)号： US10714441B2公开(公告)日： 2020-07-14
- 发明人: Hsiao-Tsung Yen , Jhe-Ching Lu , Yu-Ling Lin , Chin-Wei Kuo , Min-Chie Jeng
- 申请人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 申请人地址： TW Hsin-Chu
- 专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人： Taiwan Semiconductor Manufacturing Company, Ltd.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Slater Matsil, LLP
- 主分类号： H01L23/00
- IPC分类号： H01L23/00 ; H01L25/065 ; H01L25/18 ; H01L25/00
摘要：
An integrated circuit package includes a die. An electrically conductive layer comprises a redistribution layer (RDL) in the die, or a micro-bump layer above the die, or both. The micro bump layer comprises at least one micro-bump line. A filter comprises the electrically conductive layer. A capacitor comprises an electrode formed in the electrically conductive layer.
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