- 专利标题: Solid-state imaging element and imaging device
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申请号: US16293384申请日: 2019-03-05
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公开(公告)号: US10714521B2公开(公告)日: 2020-07-14
- 发明人: Yuhi Yorikado , Atsushi Toda , Susumu Inoue
- 申请人: SONY SEMICONDUCTOR SOLUTIONS CORPORATION
- 申请人地址: JP Kanagawa
- 专利权人: Sony Semiconductor Solutions Corporation
- 当前专利权人: Sony Semiconductor Solutions Corporation
- 当前专利权人地址: JP Kanagawa
- 代理机构: Sheridan Ross P.C.
- 优先权: com.zzzhc.datahub.patent.etl.us.BibliographicData$PriorityClaim@281023eb
- 主分类号: H01L27/14
- IPC分类号: H01L27/14 ; H01L27/146 ; G02B3/00 ; H01L31/107 ; H04N5/374 ; H01L31/0224 ; H01L31/0232 ; H04N5/359
摘要:
To improve detection efficiency in a solid-state imaging element including a SPAD in which an electrode and wiring are placed in a central portion. A solid-state imaging element includes a photodiode and a light collecting section. The photodiode includes a light receiving surface and an electrode placed on the light receiving surface, and that outputs an electrical signal in accordance with light incident on the light receiving surface in a state where a voltage exceeding a breakdown voltage is applied to the electrode. The light collecting section causes light from a subject to be collected in the light receiving surface other than a region where the electrode is placed.
公开/授权文献
- US20190198548A1 SOLID-STATE IMAGING ELEMENT AND IMAGING DEVICE 公开/授权日:2019-06-27
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