Invention Grant
- Patent Title: Heat spreader with high heat flux and high thermal conductivity
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Application No.: US15064304Application Date: 2016-03-08
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Publication No.: US10727156B2Publication Date: 2020-07-28
- Inventor: Steve Qingjun Cai , Chung-Lung Chen , Chialun Tsai
- Applicant: TELEDYNE SCIENTIFIC & IMAGING, LLC
- Applicant Address: US CA Thousand Oaks
- Assignee: TELEDYNE SCIENTIFIC & IMAGING, LLC
- Current Assignee: TELEDYNE SCIENTIFIC & IMAGING, LLC
- Current Assignee Address: US CA Thousand Oaks
- Agency: K&L Gates LLP
- Main IPC: F28D15/02
- IPC: F28D15/02 ; H01L23/427 ; B23P15/26 ; F28D15/04 ; H01L21/48 ; H05K3/22 ; F28F21/04
Abstract:
A system and method is disclosed for fabricating a heat spreader system, including providing a plurality of bottom microporous wicks recessed in a bottom substrate, bonding a center substrate to the bottom substrate, and bonding a top substrate having a top chamber portion to the center substrate to establish a first vapor chamber with said plurality of bottom microporous wicks.
Public/Granted literature
- US20160190037A1 HEAT SPREADER WITH HIGH HEAT FLUX AND HIGH THERMAL CONDUCTIVITY Public/Granted day:2016-06-30
Information query
